Title:
ＲＦＩＤタグ付きパッケージ
Document Type and Number:
Japanese Patent JP6785966
Kind Code:
B2
Abstract:
This package 10 with an RFID tag comprises: a package main body 12 which is formed from a non-conductive material; a metal layer 16 which is partially provided on the outer surface of the package main body 12; an RFIC chip which is provided with first and second input/output terminals and is arranged on the package main body 12; a first antenna conductor layer 34 which has one end connected to the first input/output terminal of the RFIC chip, while having the other end act as an open end, and which is arranged in a portion 12g of the package main body 12, where the metal layer 16 is not provided; and a second antenna conductor layer 36 which has one end connected to the second input/output terminal of the RFIC chip, while having the other end connected to the metal layer 16 directly or via a capacitor, and which is arranged on the package main body 12.
Inventors:
Ryohei Omori
Application Number:
JP2019525921A
Publication Date:
November 18, 2020
Filing Date:
August 22, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
G06K19/077; H01Q1/38; H01Q9/16; H01Q19/02
Domestic Patent References:
| JP2013258779A | ||||
| JP2016226047A | ||||
| JP2017095147A | ||||
| JP2009031893A |
Attorney, Agent or Firm:
Norihito Yamao
Hiroshi Okabe
Hiroshi Okabe