To solve such problems that a miniaturization and a high radiating formation are difficult, since variant components with different heights or the like are individually mounted in a flat thick circuit conductor and a thick circuit conductor with level differences in a state of being mounted on a heat sink, in conventional insulating substrates.
By providing a radiating substrate 11 with the variant components mounting portion 20 which bends the lead frame 13 to a part thereof and raises an intensity by using an anchor 16 so as to correspond to mounting of the variant components 22 which is difficult to be surface-mounted, such as a power semiconductor, a transformer or the like, mountability of a variant components mounting portion 20 is enhanced, and heat generated in variant components 22 is radiated to a lead frame 13, a heat transmission layer 14, a metal plate 15 or the like, thereby responding to a high current and the high radiating formation.
TANIGUCHI TOSHIYUKI
KONO HITOSHI
Hiroki Naito
Daisuke Nagano