放射線硬化型粘着シート - NITTO DENKO CORPORATION

Title:

放射線硬化型粘着シート

Document Type and Number:

Japanese Patent JP4514428

Kind Code:

B2

Abstract:

To provide a radiation-cuing pressure-sensitive adhesive sheet capable of forming an adhesive layer on an adherend inexpensively and simply with high accuracy even when the surface of the adherend (e.g. plastic molding) has a three-dimensional shape and to provide a radiation-curing pressure-sensitive adhesive sheet capable of forming a three-dimensional pattern even on the surface of an adhesive layer.

The radiation-curing pressure-sensitive adhesive sheet is one comprising a pressure-sensitive adhesive composition mainly consisting of a pressure-sensitive adhesive polymer and a radiation-curing component, wherein the pressure-sensitive adhesive composition has a shear storage modulus (G') of 1×106Pa or smaller at 23°C, and has tensile storage modulus (E') of 2×107Pa or larger at 40°C after being radiation-cured, and the pressure-sensitive sheet after being radiation-cured produces ≤20 μg/g(pressure-sensitive adhesive composition) of a photopolymerization-initiator-derived gas when heated at 80°C for 10 min. In one embodiment, the radiation-curing pressure-sensitive adhesive sheet is used for forming a pattern.

Inventors:

Tatsumi Amano

Application Number:

JP2003347888A

Publication Date:

July 28, 2010

Filing Date:

October 07, 2003

Export Citation:

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Assignee:

NITTO DENKO CORPORATION

International Classes:

C09J7/02; C09J11/06; C09J201/00

Domestic Patent References:

JP11140398A
JP60069179A
JP2002338936A
JP2003129008A

Attorney, Agent or Firm:

Patent Business Corporation Unias International Patent Office
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi

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