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Title:
RADIATION-SENSITIVE COMPOSITION AND METHOD FOR MANUFACTURING LOW-MOLECULAR-WEIGHT COMPOUND FOR USE THEREIN
Document Type and Number:
Japanese Patent JP2013145384
Kind Code:
A
Abstract:

To provide a radiation-sensitive composition satisfying high sensitivity, high resolution, good pattern form, and good line edge roughness at the same time.

A radiation-sensitive composition comprises: (A) a low-molecular-weight compound having, per molecule, one or more acid-dissociable groups which decompose by action of acid to enhance solubility in alkaline developing solution and one or more radiation-sensitive acid-generating groups which generate the acid by irradiation with actinic rays or a radiation and having a number-average molecular weight (Mn) of 500 to 4,000 expressed in terms of polystyrene measured by gel permeation chromatography (GPC); and (B) a solvent. The low-molecular-weight compound (A) is a compound shown by the following formula (1).


Inventors:
MATSUMURA SHINJI
SHIMIZU DAISUKE
KAI TOSHIYUKI
Application Number:
JP2013029533A
Publication Date:
July 25, 2013
Filing Date:
February 18, 2013
Export Citation:
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Assignee:
JSR CORP
International Classes:
G03F7/004; G03F7/039; H01L21/027; C07C309/06; C07C309/12; C07C381/12
Domestic Patent References:
JP2001199955A2001-07-24
JP2002107920A2002-04-10
JP2006336005A2006-12-14
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike