Title:
Radiation-sensitive resin composition, cured film and its forming method, and display element
Document Type and Number:
Japanese Patent JP6318957
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition capable of forming a cured film which is excellent in radiation sensitivity, storage stability, chemical resistance, pattern adhesion after development, pattern adhesion after post exposure and transparency; a cured film formed from the radiation-sensitive resin composition; a method for forming the cured film; and a display element provided with the cured film.SOLUTION: A radiation-sensitive resin composition contains a radiation-sensitive acid generating body including at least one of [A] a polymer component including a structural unit having a group represented by formula (1) and a structural unit having a crosslinkable group, in the same or different polymer; and [B] a compound having an oxime sulfonate group and an N-sulfonyloxyimide compound. In the formula (1), R, Rand Reach represents a hydrogen atom, an alkyl group, an alicyclic hydrocarbon group, an aryl group, a group in which a part of or the whole hydrogen atoms in these groups is substituted with a substituent group, or -SiR, Rrepresents an alkyl group having 1 to 10 carbon atoms.SELECTED DRAWING: None
Inventors:
Naruko Yoshito
Application Number:
JP2014157156A
Publication Date:
May 09, 2018
Filing Date:
July 31, 2014
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
G03F7/075; C08F220/18; C08F220/26; C08F222/20; G03F7/004; G03F7/039; H01L51/50; H05B33/22
Domestic Patent References:
| JP2011215503A | ||||
| JP2010090328A | ||||
| JP2012013962A | ||||
| JP2011227106A | ||||
| JP2008506010A |
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Yoshiaki Negi
Kenichi Fujinaka
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Yoshiaki Negi
Kenichi Fujinaka