Title:
RADIATION SENSITIVE RESIN COMPOSITION AND MANUFACTURE OF POLYMER TO BE USED FOR SAME
Document Type and Number:
Japanese Patent JP3780518
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide the radiation sensitive resin composition and capable of forming a pattern high in resolution and precision and dry etching resistance by polymerizing a specified styrene monomer in the presence of a specific radical and a radical polymerization initiator.
SOLUTION: The styrene monomer represented by formula I is polymerized in the presence of a radical represented by formula II and the radical and the radical polymerization initiator to produce the polymer having the repeating units each represented by formula III. In formulae I-III, R1 is an H atom or a methyl group; R2 is a -OH or -O-C-(=O)-O-(CH3)3 group or the like; each of R3 and R4 is, independently, a straight or branched or cycle 1-6C alkyl group; each of R5-R7 is, independently, an H atom or a hydroxy or alkyl group or the like; and each of R8-R11 is, independently, a 1-10C alkyl or aralkyl group.
Inventors:
Koshio Koshimura
Takaki Tanabe
Kenji Yasuda
Takeshi Fukuda
Takaki Tanabe
Kenji Yasuda
Takeshi Fukuda
Application Number:
JP9588597A
Publication Date:
May 31, 2006
Filing Date:
April 14, 1997
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
G03F7/004; G03F7/039; C08F2/38; C08F4/32; C08F12/22; C08L25/18; G03F7/031; H01L21/027; (IPC1-7): G03F7/039; G03F7/039; C08F4/32; C08F12/22; C08L25/18; G03F7/004; G03F7/031; H01L21/027
Domestic Patent References:
| JP6199916A | ||||
| JP6043653A | ||||
| JP7311464A | ||||
| JP8269108A | ||||
| JP9087309A |
Attorney, Agent or Firm:
Masataka Oshima