Title:
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIN PATTERN, RESIN PATTERN AND ITS USE
Document Type and Number:
Japanese Patent JP3960042
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having an excellent relative dielectric constant, heat-resistant dimensional stability, solvent resistance, flatness, coating uniformity, transparency, heat-resistant color changing properties and storage stability.
SOLUTION: The radiation-sensitive resin composition comprises (A) an alicyclic olefin resin, (B) an acid generator, (C) a crosslinking agent and (D) a solvent. The solvent (D) is a mixture solvent composed of two or more different solvents and 5 to 40 wt.% of the mixture solvent is a non-proton polar solvent (D1) containing nitrogen atoms or sulfur atoms.
Inventors:
Junji Koidemura
Hirokazu Higashi
Hirokazu Higashi
Application Number:
JP2001397644A
Publication Date:
August 15, 2007
Filing Date:
December 27, 2001
Export Citation:
Assignee:
Zeon Corporation
International Classes:
G03F7/004; C08F32/00; C08G61/08; G03F7/022; G03F7/032; G03F7/038; G03F7/039; (IPC1-7): G03F7/004; C08F32/00; C08G61/08; G03F7/022; G03F7/032; G03F7/038
Domestic Patent References:
| JP2001296659A | ||||
| JP2001194776A | ||||
| JP11052574A | ||||
| JP2000122295A |
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