Title:
RADIATION-SENSITIVE RESIN COMPOSITION, RESIST PATTERN FORMING METHOD, AND COMPOUND
Document Type and Number:
Japanese Patent JP2023108593
Kind Code:
A
Abstract:
To provide a radiation-sensitive resin composition, a resist pattern forming method, and a compound which are capable of forming a resist pattern good in sensitivity to exposure light and excellent in CDU performance and resolution.SOLUTION: The radiation-sensitive resin composition contains: a polymer whose solubility in a developer changes by the action of an acid; a radiation-sensitive acid generator; and a compound represented by the following formula (1).SELECTED DRAWING: None
Inventors:
KINOSHITA NATSUKO
TANIGUCHI TAKUHIRO
NISHIGORI KATSUTOSHI
KIRIYAMA KAZUYA
TANIGUCHI TAKUHIRO
NISHIGORI KATSUTOSHI
KIRIYAMA KAZUYA
Application Number:
JP2022192373A
Publication Date:
August 04, 2023
Filing Date:
November 30, 2022
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/004; C07D327/08; C07D333/76; C08F220/26; G03F7/039
Attorney, Agent or Firm:
Yoshinori Ikeda
Kazunori Amano
Katsumasa Fujimoto
Koji Ishida
Masako Matsuura
Kazunori Amano
Katsumasa Fujimoto
Koji Ishida
Masako Matsuura