Radiation-sensitive resin composition, resist pattern forming method, polymer and compound

Title:

Radiation-sensitive resin composition, resist pattern forming method, polymer and compound

Document Type and Number:

Japanese Patent JP6331359

Kind Code:

B2

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Inventors:

Hiroyuki Nii
Ikui Junto
Tomoki Nagai

Application Number:

JP2013245499A

Publication Date:

May 30, 2018

Filing Date:

November 27, 2013

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