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Title:
感放射線性樹脂組成物及びレジストパターン形成方法
Document Type and Number:
Japanese Patent JP6540375
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in all of depth of focus in a mixture pattern, an exposure latitude, releasing property of a resist pattern and development defect suppressing property.SOLUTION: The radiation-sensitive resin composition comprises a plurality of polymers having an acid dissociable group and a radiation-sensitive acid generator represented by formula (2) below. The composition has such characteristics that: in the plurality of polymers, each polymer has an acid dissociable group different from others; at least two polymers in the plurality of polymers have different weight average molecular weights from each other; a difference between the maximum and the minimum of the weight average molecular weights in the above polymers is 2,000 or more; and the content of the polymer having the minimum weight average molecular weight is 50 mass% or more with respect to all of the plurality of polymers. The acid dissociable group different from others by each polymer preferably contains a monocyclic structure. The weight average molecular weight of the polymer having the minimum weight average molecular weight in the above polymers is preferably 2,000 or more and 10,000 or less.SELECTED DRAWING: None

Inventors:
Kenji Mochida
Takashi Mori
Application Number:
JP2015167268A
Publication Date:
July 10, 2019
Filing Date:
August 26, 2015
Export Citation:
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Assignee:
JSR CORPORATION
International Classes:
G03F7/039; G03F7/004; G03F7/20
Domestic Patent References:
JP2012181524A
JP2012233968A
JP2010250063A
JP2013083966A
JP2013097002A
JP2010250074A
Foreign References:
US20060024610
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Kenichi Fujinaka