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Patent Searching and Data


Title:
感放射線性樹脂組成物及びレジストパターン形成方法
Document Type and Number:
Japanese Patent JP7447725
Kind Code:
B2
Abstract:
To provide a radiation-sensitive resin composition that can form a resist pattern having excellent sensitivity to exposure light and having excellent LWR performance and resolution, a resist pattern forming method and a compound.SOLUTION: A radiation-sensitive resin composition contains a polymer having a constitutional unit including an acid dissociable group, and a compound in which two aromatic rings are bonded by single bond with a substituted, triaryl sulfonium cation, and the anion part is sulfonic acid or carboxylic acid.SELECTED DRAWING: None

Inventors:
Maruyama Lab
Kei Nishikori
Natsuko Kinoshita
Kazuya Kiriyama
Taniguchi Takuhiro
Application Number:
JP2020128527A
Publication Date:
March 12, 2024
Filing Date:
July 29, 2020
Export Citation:
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Assignee:
JSR CORPORATION
International Classes:
G03F7/004; C07C65/05; C07C309/12; C07C309/17; C07D317/44; C07D333/52; C08F20/16; G03F7/039; G03F7/20
Domestic Patent References:
JP2009069381A
JP2009013155A
JP2012136511A
JP2011039502A
JP2012072107A
JP2014224984A
Foreign References:
WO2008066011A1
Attorney, Agent or Firm:
Yoshinori Ikeda
Kazunori Amano
Katsumasa Fujimoto
Koji Ishida
Masako Matsuura