To obtain a radiation-sensitive resin composition which exhibits a sufficient process margin and has heat resistance, solvent resistance and transparency by compounding a copolymer formed from an unsaturated carboxylic acid and/or its anhydride, an epoxidized (meth)acrylate and other olefinic unsaturated compounds with a 1,2-quinonediazide compound.
This composition is prepared by compounding 100 pts.wt. copolymer formed from 5-40 wt.% unsaturated carboxylic acid and/or its anhydride, 5-60 wt.% monomer represented by formula I (wherein R is H or methyl; R1 is 1-4C alkyl; and n is 1-6) and/or monomer represented by formula II (wherein R2 is H or methyl; and p and q are each 1-6) and 10-70 wt.% olefinic unsaturated compounds other than the foregoing compounds with 5-100 pts.wt. 1,2- quinonediazide compound. The composition is suitable for forming an interlayer insulation film or a microlens.
ENDO MASAYUKI
MINOWA TAKAKI
