Title:
RADIATION SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2002023371
Kind Code:
A
Abstract:
To provide a new radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing a semiconductor device in a high yield.
The radiation sensitive resin composition contains (A) a resin having at least one heterocyclic structure of formula (1) (where R1 is H, a 1-6C linear, branched or cyclic alkyl, a 1-6C linear, branched or cyclic alkoxy or a 2-7C linear, branched or cyclic alkoxycarbonyl) in a side chain and (B) a radiation sensitive acid generating agent.
Inventors:
NISHIMURA YUKIO
DOUKI KATSUJI
YAMAMOTO MASASHI
KAJITA TORU
SHIMOKAWA TSUTOMU
DOUKI KATSUJI
YAMAMOTO MASASHI
KAJITA TORU
SHIMOKAWA TSUTOMU
Application Number:
JP2000204223A
Publication Date:
January 23, 2002
Filing Date:
July 05, 2000
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/039; C08F20/60; C08F32/08; C08K5/00; C08L101/06; H01L21/027; (IPC1-7): G03F7/039; C08F20/60; C08F32/08; C08K5/00; C08L101/06; H01L21/027
Attorney, Agent or Firm:
Toshiaki Fukuzawa