To provide a new radiation sensitive resin composition having high transparency to radiation and superior developability, excellent in adhesiveness to a substrate as well as in basic solid state properties as a resist, e.g. sensitivity, resolution and pattern shape, causing no development defects in microfabrication and capable of producing semiconductor devices in a high yield.
The radiation sensitive resin composition contains (A) a copolymer having repeating units of formula (1) [wherein R1-R3 are each H, a 1-4C alkyl, a monovalent O-containing polar group or a monovalent N-containing polar group; R4-R6 are each H, a 1-6C alkyl, a 1-6C alkoxy or a 2-7C alkoxycarbonyl; and (n) and (m) are each an integer of 0-2] as essential units and (B) a radiation sensitive acid generating agent.
DOUKI KATSUJI
YAMAMOTO MASASHI
KAJITA TORU
SHIMOKAWA TSUTOMU
