RADIATION-SENSITIVE RESIN COMPOSITION

Japanese Patent JP2003241384

A

To provide a radiation-sensitive resin composition having high transparency to a radiation and useful as a chemically amplified resist excellent in sensitivity, resolution, dry etching resistance and pattern shape.

The radiation-sensitive resin composition comprises (A) a resin typified by a copolymer of 2-methyl-2-adamantyl methacrylate, 3-hydroxy-1- adamantyl methacrylate and a methacrylic ester of formula (1), (B) a radiation- sensitive acid generator typified by triphenylsulfonium nonafluoro-n- butanesulfonate or 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium perfluoro-n- octanesulfonate and (C) a solvent. Preferably the solvent (C) includes at least one selected from the group comprising propylene glycol monomethyl ether acetate, 2-heptanone and cyclohexanone.

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NISHIMURA YUKIO
YAMAMOTO MASASHI
ISHII HIROYUKI
MARK SLEZAK
BRUNSVOLD WILLIAM R
MARGARET C LAWSON
CHEN KUANG-JUNG
KWONG RANEE W
VARANASI PUSHKARA RAO

JP2002046679A

August 27, 2003

February 22, 2002

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JSR CORP
IBM
JSR MICRO INC

G03F7/039; C08F220/18; C08F220/28; H01L21/027; (IPC1-7): G03F7/039; C08F220/18; C08F220/28; H01L21/027

Toshiaki Fukuzawa

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