Title:
RADIATION SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003322971
Kind Code:
A
Abstract:
To provide a radiation sensitive resin composition as a chemically amplifying resist which is sensitive to active radiation, for example, far UV rays represented by KrF excimer laser or ArF excimer laser and which can form a resist pattern with excellent uniformity in film thickness, excellent adhesion property with a substrate, accuracy, sensitivity, resolution and so on.
The radiation sensitive resin composition contains: (A) an alkali insoluble or alkali hardly soluble resin containing an acid-dissociable group which changes into alkali soluble when the acid dissociable group is dissociated; (B) a radiation sensitive acid producing agent; and (C) a compound expressed by general formula (1) as a solvent.
Inventors:
SOYANO AKIMASA
KATAOKA ATSUKO
KUROKAWA MITSUO
KATAOKA ATSUKO
KUROKAWA MITSUO
Application Number:
JP2002127446A
Publication Date:
November 14, 2003
Filing Date:
April 26, 2002
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/039; C08F20/18; C08F32/00; G03F7/004; H01L21/027; (IPC1-7): G03F7/039; C08F20/18; C08F32/00; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Shuji Iwamiya