Title:
RADIATION-SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003330193
Kind Code:
A
Abstract:
To provide a radiation-sensitive resin composition having high transparency for radiation and an excellent balance in the characteristics as a resist such as sensitivity, resolution, dry etching durability, pattern profile, mask pattern dependence, exposure allowance or the like.
The radiation-sensitive resin composition contains (A) a resin which is changed into alkali-soluble by the effect of an acid and is represented by a resin having a repeating unit derived from a compound expressed by formula (i-1) or (ii-2) and (B) a radiation-sensitive acid generating agent. In each formula, R represents a hydrogen atom or a methyl group.
Inventors:
NISHIMURA YUKIO
ISHII HIROYUKI
NISHIMURA ISAO
KOBAYASHI HIDEKAZU
ISHII HIROYUKI
NISHIMURA ISAO
KOBAYASHI HIDEKAZU
Application Number:
JP2002136201A
Publication Date:
November 19, 2003
Filing Date:
May 10, 2002
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/039; C08F220/00; C08F232/00; H01L21/027; (IPC1-7): G03F7/039; C08F220/00; C08F232/00; H01L21/027
Attorney, Agent or Firm:
Toshiaki Fukuzawa