Title:
RADIATION-SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003345020
Kind Code:
A
Abstract:
To provide a composition having high transparency for radiation at short wavelengths, excellent solubility with a developer and excellent sensitivity, pattern profile and etching resistance.
The radiation-sensitive resin composition contains a resin having a functional group which increases solubility with an alkali by the effect of an acid, and a radiation-sensitive acid generating agent. The resin has a repeating unit expressed by formula (1). In formula (1), R independently represents a hydrogen atom, a 1-4C alkyl group or a 1-4C perfluoroalkyl group, R1 represents a hydrocarbon group or an oxygen-containing hydrocarbon group, n is 0 or 1 and m is 1 or 2.
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Inventors:
NISHIMURA YUKIO
ISHII HIROYUKI
YAMAMOTO MASASHI
NISHIMURA ISAO
KOBAYASHI HIDEKAZU
ISHII HIROYUKI
YAMAMOTO MASASHI
NISHIMURA ISAO
KOBAYASHI HIDEKAZU
Application Number:
JP2002151225A
Publication Date:
December 03, 2003
Filing Date:
May 24, 2002
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/039; C08F32/08; H01L21/027; (IPC1-7): G03F7/039; C08F32/08; H01L21/027
Attorney, Agent or Firm:
Waki