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Title:
RADIATION-SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2010282189
Kind Code:
A
Abstract:

To provide a radiation-sensitive resin composition that has small LWR (Line Width Roughness) and MEEF (Mask Error Enhancement Factor), has an excellent crude/dense bias, and has high storage stability.

The radiation-sensitive resin composition includes a resin (A), a radiation-sensitive acid generator (B), an acid diffusion controller (C), and a solvent (D). The acid generator (B) is expressed by general formula (I). The solvent (D) includes about 50-90 mass% of propylene glycol monomethyl ether acetate to the total solvent. In the general formula (I), M+ represents a sulfonium cation or an iodonium cation.


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Inventors:
SHIMOKAWA TSUTOMU
EHATA TAKUMA
Application Number:
JP2010107156A
Publication Date:
December 16, 2010
Filing Date:
May 07, 2010
Export Citation:
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Assignee:
JSR CORP
International Classes:
G03F7/004; C07C25/00; C08F220/18; G03F7/039; H01L21/027; C07C309/12; C07C381/12
Domestic Patent References:
JP2008007410A2008-01-17
JP2009169205A2009-07-30
JP2010197849A2010-09-09
JP2009075428A2009-04-09
JP2008129433A2008-06-05
Foreign References:
WO2009041556A12009-04-02
WO2009051088A12009-04-23
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike



 
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