Title:
Radiation-sensitive resin composition
Document Type and Number:
Japanese Patent JP6195456
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition capable of forming a cured film having an excellent transparency and of avoiding, even when exposed and then developed by using an aqueous tetramethyl ammonium hydroxide solution, an excessive dissolution of the exposed portion of the radiation-sensitive resin composition; a method for forming a patterned resin film using the radiation-sensitive resin composition; an insulating film formed by using the radiation-sensitive resin composition; and a display device possessing the insulating film.SOLUTION: An alkali-soluble resin (A) consisting of a copolymer including (a1) units derived from an unsaturated carboxylic acid and a specified quantity of (a2) units derived from an epoxy group-free alicyclic skeleton-containing unsaturated compound, a photopolymerizable compound (B), and a photopolymerization initiator (C) including an oxime ester compound having a specified structure are mixed with a radiation-sensitive resin composition.
Inventors:
Akira Katano
Yasuhide Ouchi
Someya Kazuya
Yasuhide Ouchi
Someya Kazuya
Application Number:
JP2013049068A
Publication Date:
September 13, 2017
Filing Date:
March 12, 2013
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
C08F2/44; C08F2/50; C08F220/26; G02F1/1333; G02F1/1339; G03F7/031; G03F7/033
Domestic Patent References:
| JP2013041152A | ||||
| JP2014170098A |
Attorney, Agent or Firm:
Masayuki Masabayashi