Title:
RADIATOR
Document Type and Number:
Japanese Patent JP2021077840
Kind Code:
A
Abstract:
To develop new applications of an LED radiator 10 including a flexible printed wiring board 11, a plurality of LED chips 12 that serve as heat sources mounted on the flexible printed wiring board 11, and a sealing layer 14 made of soft plastic resin and sealing the LED chip 12.SOLUTION: An LED heating element 10 is insert-molded into a soft plastic resin or a hard plastic foam, and the entire circumference of the LED heating element 10 is airtightly covered with a plastic resin, and the LED heating element 10 is reinforced with the coated plastic resin to mold a radiator 1 that dissipates heat from the LED heating element 10 through the plastic resin.SELECTED DRAWING: Figure 1
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Inventors:
TOTANI TSUTOMU
Application Number:
JP2019231094A
Publication Date:
May 20, 2021
Filing Date:
December 23, 2019
Export Citation:
Assignee:
BEAT SONIC KK
International Classes:
H01L23/29
Attorney, Agent or Firm:
Hajime Miyake
Masaya Ariga
Masaya Ariga