Title:
反転させたマイクロストリップ伝送線路を有する無線周波数微小電気機械システムおよびその製造方法
Document Type and Number:
Japanese Patent JP6868006
Kind Code:
B2
Abstract:
A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.
Inventors:
Lee, Young Jae
Ianotti, Joseph Alfred
Keimel, Christopher Fred
Capsta, Christopher James
Ianotti, Joseph Alfred
Keimel, Christopher Fred
Capsta, Christopher James
Application Number:
JP2018511119A
Publication Date:
May 12, 2021
Filing Date:
July 21, 2016
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
H01P3/08; B81B7/02; H01H59/00
Domestic Patent References:
| JP2011182311A |
Foreign References:
| US20040262645 | ||||
| US20100019872 | ||||
| US20090029526 | ||||
| US20090246929 | ||||
| CN104409422A |
Attorney, Agent or Firm:
Kazuya Sekiguchi
Arakawa Satoshi
Hirokazu Ogura
Takuto Tanaka
Arakawa Satoshi
Hirokazu Ogura
Takuto Tanaka