To provide a radio wave absorbing heat conduction sheet having qualities of both noise radio wave absorption and high thermal conductivity which absorbs generated heat and leads it outside.
A radio wave absorbing heat conduction sheet 1 which can be directly mounted on a part between a semiconductor device like a CPU 2 and a heat sink 3 without interposing a member like-as adhesive material by the effect of an adhesive surface is a nonrigid sheet whose heat resisting temperature is at least 150°C and whose rubber hardness is at most 50. Since the sheet is soft and adherence in an installation part when the sheet is mounted on an electronic circuit becomes excellent, absorption of heat and electromagnetic wave which are generated from the semiconductor device becomes excellent. By constituting the radio wave absorbing heat conduction sheet 1 with proportion of liquid silicon resin 100 pts.wt., soft magnetic powder 300 pts.wt. and nonmagnetic inorganic powder 100 pts.wt., a radio wave absorbing heat conduction sheet wherein radio wave absorbing property is high, in paticular, at 100-several GHz and thermal conductivity is excellent is obtained.
ISHIKURA MAKOTO
CHIKADA JUNJI
ONO HIROAKI
TERANISHI MANABU
