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Title:
RE-RELEASE TYPE ADHESIVE AND RE-RELEASE TYPE ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2010132916
Kind Code:
A
Abstract:

To provide a re-release type adhesive which, when subjected to curing reaction caused by irradiation with radiation, shows a sufficient drop of adhesion and causes the adherend to be warped to a low level as developed by the shrinkage force caused by the curing reaction.

The present invention provides a re-release type adhesive comprising as a main component a radiation-reactive polymer having one carbon-carbon double bond and an intramolecular side chain having chain length of 6 or more in terms of the number of atoms and showing a shrinkage force of 30 MPa or less as developed by curing reaction caused by irradiation with radiation. The re-release type adhesive can be provided by reacting a polymer having a side chain including a hydroxyl group and an isocyanate compound having one carbon-carbon double bond.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
HASHIMOTO KOICHI
FUKUOKA TAKAHIRO
AKAZAWA MITSUHARU
NAKAGAWA YOSHIO
KUBOZONO TATSUYA
Application Number:
JP2010017664A
Publication Date:
June 17, 2010
Filing Date:
January 29, 2010
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
C09J151/06; C09J4/00; C09J7/02; C09J201/02; H01L21/301; H01L21/304
Domestic Patent References:
JPH09286956A1997-11-04
JPH02187478A1990-07-23
JPH0827239A1996-01-30
Attorney, Agent or Firm:
Yukihisa Goto