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Title:
REACTIVE HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP2005314445
Kind Code:
A
Abstract:

To obtain a reactive hot-melt adhesive that keeps a long adhesion time after application, improves initial adhesive power, thereby prevents a strain adherend from separating and peeling, especially prevents an adherend in a working environment (atmosphere at 35°C) in the summer from separating and peeling, extremely shortens a curing time before the cutting work of a bonded body and does not contaminate a working environment and to provide a method for purifying a polyether, which has increased productivity and reduces an amount of an adsorbent used.

The reactive hot-melt adhesive comprises a urethane prepolymer (A) obtained by reacting a polyisocyanate (a) with a polyol (b) and a rosin (c) containing active hydrogen to be reacted with an isocyanate and a thermoplastic elastomer (D) as essential components.


Inventors:
KOTANI KAZUYA
KAWAKAMI TAKANORI
IWAWAKI EIJI
Application Number:
JP2004130566A
Publication Date:
November 10, 2005
Filing Date:
April 27, 2004
Export Citation:
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Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08G18/40; C08G18/65; C09J109/00; C09J123/00; C09J167/00; C09J175/04; C09J175/06; C09J175/08; C09J177/00; C09J201/00; (IPC1-7): C09J175/04; C08G18/40; C08G18/65; C09J109/00; C09J123/00; C09J167/00; C09J175/06; C09J175/08; C09J177/00; C09J201/00