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Title:
REACTIVE HOT-MELT COMPOSITION, COMPOSITION FOR PREPARING REACTIVE HOT-MELT COMPOSITION AND FILMY HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP3754475
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a reactive hot-melt composition, capable of readily performing hot-melt coating, rapidly cross-linkable by heating after bonding an adherend without requiring radiation and water and without producing water at the time of cross-linking and having a high fluidity at the time of hot melting.
SOLUTION: This precursor composition comprises a thermoplastic polymer containing a polyolefin having epoxy groups in the molecule and a radiation- polymerizable component containing an aliphatic alkyl (meth)acrylate and an acrylic compound having a functional group reactive with epoxy group in the molecule. Furthermore, the hot-melt composition is obtained by exposing the precursor composition to radiation and polymerizing the radiation-polymerizable component.


Inventors:
Koichiro Kawate
Emi Ishii
Application Number:
JP28314295A
Publication Date:
March 15, 2006
Filing Date:
October 31, 1995
Export Citation:
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Assignee:
3M COMPANY
International Classes:
C08L33/02; C09J133/14; C08L33/04; C08L33/14; C09J4/06; C09J7/00; C09J123/08; C09J133/02; C09J133/04; C09J163/00; C08L93/04; H05K3/30; (IPC1-7): C08L33/02; C08L33/14; C09J7/00; C09J133/02; C09J133/14; C09J163/00
Domestic Patent References:
JP62091536A
JP63101413A
JP63503549A
JP59149944A
JP9025371A
Attorney, Agent or Firm:
Aoyama Aoi
Yasuo Shibata