Title:
反応性モノマー、及びそれを含む樹脂組成物
Document Type and Number:
Japanese Patent JP4691555
Kind Code:
B2
Abstract:
A material for use in flexible printed wiring board having high reliability and allowing for processing fine wiring includes a compound represented by the following general formula (I): wherein one of X and Y represents O and the other represents NAr2R2, and R1, R2, Ar1, and Ar2 are as defined in the specification, and a resin composition comprising the compound as a reactive monomer.
Inventors:
Nao Watanabe
Kenji Nakajima
Keizo Tanaka
Satoru Namba
Kenji Nakajima
Keizo Tanaka
Satoru Namba
Application Number:
JP2007522277A
Publication Date:
June 01, 2011
Filing Date:
June 20, 2006
Export Citation:
Assignee:
Manac Inc.
International Classes:
C07D209/48; B32B15/088; B32B27/34; C07D307/90; C08J5/18; C08K5/1535; C08K5/3417; C08L79/08; C08L101/02; C09D179/08; C09J179/08
Domestic Patent References:
| JP2005146170A | 2005-06-09 | |||
| JP2003213130A | 2003-07-30 |
Foreign References:
| US5412066A | 1995-05-02 |
Attorney, Agent or Firm:
Hajime Tsukuni
Yoko Tanaka
Fusayuki Saito
Koshiro Tsukuda
Yoko Tanaka
Fusayuki Saito
Koshiro Tsukuda