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Patent Searching and Data


Title:
REACTIVE SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JPH06264239
Kind Code:
A
Abstract:

PURPOSE: To eliminate the damage due to an abnormal discharge by adjusting the flow rate of an active gas on receipt of a signal for controlling the amt. of the active gas to be introduced when an abnormal discharge is generated.

CONSTITUTION: Gaseous Ar as a discharge gas and gaseous N2 as an active gas are introduced into a film forming chamber 1 provided with a target 3 in the sputtering device. The electrical characteristics of the discharge in the film forming process are detected by detectors 8 and 9. The data detected by the detectors 8 and 9 are compared with the prepared reference data by a comparator 10 to judge whether the discharge is normal or not. When the discharge is judged as abnormal by a controller 11, a signal is issued to control the amt. of the active gas (N2) to be introduced. The flow rate of the active gaseous N2 is adjusted by a flow controller 7 on receipt of the control signal. As a result, the generated abnormal discharge is rapidly returned to normal.


Inventors:
KOBAYASHI MASAHIKO
Application Number:
JP7617293A
Publication Date:
September 20, 1994
Filing Date:
March 10, 1993
Export Citation:
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Assignee:
ANELVA CORP
International Classes:
C23C14/34; C23C14/54; (IPC1-7): C23C14/54; C23C14/34
Attorney, Agent or Firm:
Tamiya HiroshiKeisuke