Title:
レシピ作成方法、作成されたレシピを用いた半導体装置の製造方法、及び基板処理装置、並びにレシピ作成プログラム
Document Type and Number:
Japanese Patent JP7270029
Kind Code:
B2
Abstract:
There is provided a technique that includes: displaying a recipe editing screen including at least a selection screen area that displays a parameter list for selection of parameters included in a recipe of a substrate processing apparatus, and a parameter editing screen area that edits the parameters; receiving a selection operation that selects an editing target parameter from the parameter list; displaying, on the parameter editing screen area, in an editable manner, a timing chart that is changeable at a time of each process in a series of processes included in a substrate processing process; and editing the editing target parameter by receiving an operation instruction to edit the timing chart displayed on the parameter editing screen area and changing the timing chart according to the operation instruction.
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Inventors:
Takatoshi Seki
Application Number:
JP2021506116A
Publication Date:
May 09, 2023
Filing Date:
March 20, 2019
Export Citation:
Assignee:
KOKUSAI ELECTRIC Inc.
International Classes:
H01L21/02
Domestic Patent References:
| JP2014138158A | ||||
| JP2014067936A |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office