PURPOSE: To obtain a reflow bonding device capable of rapidly cleaning a bonding tool without fail.

CONSTITUTION: Within a reflow bonding device provided with a bonding tool 30 thermal sublimating the coating of a thermal sublimating coated wire 50 by pulse-heating step as well as soldering a wire onto a printed-circuit board 40, a heating power supply 11 feeding heating current to the bonding tool 30 and a controller 1 controlling the power supply of the heating power supply 11, the controller 1 thermally sublimates the wire coating material coagulated and deposited on the bonding tool 30 by energizing the heating power supply 11 in the no-load state of the bonding tool 30. Preferably, the controller 1 is to be energized by exceeding the specific number of bonding shots loaded with a thermally sublimating coated wire 50 or by turning a manual switch 31 ON or a timer 80 counting a specific time so as to energize the heating power supply 11 in the no-load state of the bonding tool 30.