Title:
REFLOW DEVICE AND REFLOW SOLDERING METHOD USING IT
Document Type and Number:
Japanese Patent JP2002324972
Kind Code:
A
Abstract:
To provide a reflow device which can lessen the temperature difference between mounting parts easy to rise in temperature rise and mounting parts hard to rise its temperature, and a reflow soldering method using it.
In the main heating section 25 within a furnace body 1, upper infrared ray heaters 9A, 9B, etc., in block form which can heat each part of a printed wiring board 2 severally are arranged above a board carrying conveyor 7, and also lower infrared ray heaters 9B, 9B, etc., in block form which can heat each part of the printed wiring board 2 severally are arranged under the board carrying conveyor 7.
Inventors:
YOKOZAWA YUJI
YOSHIDA AKIRA
MATSUBARA KOJI
YOSHIDA AKIRA
MATSUBARA KOJI
Application Number:
JP2001127751A
Publication Date:
November 08, 2002
Filing Date:
April 25, 2001
Export Citation:
Assignee:
SHARP KK
International Classes:
B23K1/008; B23K31/02; H05K3/34; (IPC1-7): H05K3/34; B23K1/008; B23K31/02
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)