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Title:
リフロー炉の冷却システム
Document Type and Number:
Japanese Patent JP7402224
Kind Code:
B2
Abstract:
Disclosed in the present application is a cooling system for a reflow furnace, the reflow furnace comprising a heating zone, and the cooling system being used to regulate a temperature of the heating zone, the cooling system comprising: at least one gas inlet and at least one gas discharge port, the at least one gas inlet and the at least one gas discharge port being disposed on the heating zone; a blowing apparatus; at least one gas intake pipeline, an inlet of the at least one gas intake pipeline being connected to the blowing apparatus, an outlet of the at least one gas intake pipeline being connected to the at least one gas inlet, the at least one gas intake pipeline being able to controllably establish fluid communication between the blowing apparatus and the at least one gas inlet; and at least one gas discharge pipeline, an inlet of the at least one gas discharge pipeline being connected to the at least one gas discharge port, an outlet of the at least one gas discharge pipeline being connected to the outside, and the at least one gas discharge pipeline being able to controllably establish fluid communication between the at least one gas discharge port and the outside. The cooling system of the present application can shorten the time taken for the reflow furnace to change from a higher heating temperature to a lower heating temperature.

Inventors:
Shonfu Yen
Pon Choux
Tong Chan
Application Number:
JP2021510913A
Publication Date:
December 20, 2023
Filing Date:
August 27, 2019
Export Citation:
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Assignee:
Illinois Tours Works Inc.
International Classes:
F27D9/00; B23K1/008; F27D19/00; F27D21/00; H05K3/34
Domestic Patent References:
JP54139030U
JP9094655A
Foreign References:
CN102049587A
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mihashi
Yuichi Morimoto
Keiji Akagi