Title:
リフロー半田付け装置及び方法
Document Type and Number:
Japanese Patent JP5801047
Kind Code:
B2
Abstract:
The apparatus of the present application reduces poor soldering having gas left there at when soldering. in a reflow soldering apparatus for soldering electronic components mounted on a board by heated atmospheric gas while transferring the printed circuit board with the electronic components within preheating chambers and reflow chambers. Reflow chamber in order within a furnace, a pressure reducing chamber capable of reducing a pressure of the atmospheric gas is installed in the reflow chamber where the heated atmospheric gas circulates in the chamber, and gas involved in a heated and melted soldering part on the printed circuit board is removed at the pressure reducing chamber.
Inventors:
Yokota Yaji
Application Number:
JP2010283093A
Publication Date:
October 28, 2015
Filing Date:
December 20, 2010
Export Citation:
Assignee:
Yokota Technica Co., Ltd.
International Classes:
H05K3/34; B23K1/00; B23K1/008; B23K3/04
Domestic Patent References:
| JP6226484A | ||||
| JP2004181483A | ||||
| JP3258458A | ||||
| JP2009226456A |
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Ayako Nakamura
Satoshi Morimoto
Kyoko Tsunoda
Yu Tanaka
Tokumoto Koichi
Atsushi Watanabe
Mai Kodama
Akiko Mizushima
Toru Masuya
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Ayako Nakamura
Satoshi Morimoto
Kyoko Tsunoda
Yu Tanaka
Tokumoto Koichi
Atsushi Watanabe
Mai Kodama
Akiko Mizushima
Toru Masuya