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Title:
REFRACTORY MATERIAL COOLING STRUCTURE AND MELTING FURNACE EQUIPPED WITH IT
Document Type and Number:
Japanese Patent JP2001183073
Kind Code:
A
Abstract:

To provide a refractory material cooling structure which can economically prolong the service life of a refractory material by efficiently cooling the material and a melting furnace equipped with the structure.

In the cooling structure of a refractory material 4 constituting a furnace 1, a material 5 having a higher coefficient of thermal conductivity than the material 4 has is embedded in the refractory 4 and a cooling means 3 which cools the embedded portion is provided. The material having the higher coefficient of thermal conductivity is composed mainly of a metal, silicon carbide, or carbon and the cooling means can be constituted as an independent cooling device. In addition, the cooling structure is installed to a portion, such as the vicinity of a slag hole 10 of the melting furnace at which the wear and tear of the refractory material constituting the furnace are to be suppressed.


Inventors:
YAMADA YASUTAKA
ASAI SHIGERU
TAKENAKA SHINYA
KAWAKAMI TORU
Application Number:
JP37011099A
Publication Date:
July 06, 2001
Filing Date:
December 27, 1999
Export Citation:
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Assignee:
EBARA CORP
International Classes:
F27D1/00; F23G5/00; F23J1/00; F23M5/08; F27D1/12; (IPC1-7): F27D1/00; F23M5/08; F27D1/12
Attorney, Agent or Firm:
Matsuda Dai