Title:
冷凍サイクル装置
Document Type and Number:
Japanese Patent JP7096513
Kind Code:
B2
Abstract:
A refrigeration cycle device improves work efficiency at the time of construction related to connection pipes. A first connection flow path (50) connects a heat source unit (10) and a first use unit (31) and causes a refrigerant to flow. A second connection flow path (80) connects the heat source unit (10) and the first use unit and causes a refrigerant whose specific enthalpy is smaller than a specific enthalpy of the refrigerant that flows in the first connection flow path (50) to flow. A refrigerant whose saturation pressure is 4.5 MPa or higher when the saturation temperature reaches 65°C, or a refrigerant whose critical temperature is 65°C or lower is used. The first connection flow path (50) includes a metallic first connection pipe (51) and a metallic second connection pipe (52). A refrigerant flows from one of the heat source unit (10) and the first use unit (31) to both of the first connection pipe (51) and the second connection pipe (52), and both refrigerants that each flow in a corresponding one of the first connection pipe (51) and the second connection pipe (52) each flow from the corresponding one of the first connection pipe (51) and the second connection pipe (52) to the other of the heat source unit (10) and the first use unit (31).
Inventors:
Takuro Yamada
Yoshimi Atsushi
Eiji Kumakura
Iwata Iwata
Miyazaki Takeshi
Matsuoka Hiromune
Yoshimi Atsushi
Eiji Kumakura
Iwata Iwata
Miyazaki Takeshi
Matsuoka Hiromune
Application Number:
JP2021003476A
Publication Date:
July 06, 2022
Filing Date:
January 13, 2021
Export Citation:
Assignee:
Daikin Industries, Ltd.
International Classes:
F25B41/40; F24F1/32; F25B41/42
Domestic Patent References:
JP2008164254A | ||||
JP9137956A | ||||
JP2010002092A | ||||
JP2009299910A | ||||
JP58177765U | ||||
JP60073038U | ||||
JP6576603B1 |
Foreign References:
WO2015140827A1 | ||||
WO2012066608A1 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation