Title:
冷凍装置
Document Type and Number:
Japanese Patent JP7032667
Kind Code:
B2
Abstract:
The present disclosure provides added safety to a refrigeration apparatus. The air conditioning system (100) includes: a refrigerant circuit (RC) including a use-side circuit (RC2), a heat-source-side circuit (RC1), and a refrigerant release circuit (RC3); a refrigerant leakage detection unit (a refrigerant leakage sensor (50) and a refrigerant leakage determination unit (74)) that detects leakage of refrigerant in the use-side circuit (RC2); a heat-source-side fourth control valve (22) that enables, when being in an opened state, the heat-source-side circuit (RC1) to communicate with the refrigerant release circuit (RC3); a refrigerant release mechanism (21) that is disposed in the refrigerant release circuit (RC3) and enables, when being in a first state (an open state), the refrigerant release circuit (RC3) to communicate with an external space to release refrigerant; and a controller (70). When no leakage of refrigerant in the use-side circuit (RC2) is detected, the controller (70) controls the heat-source-side fourth control valve (22) to a closed state. When leakage of refrigerant in the use-side circuit (RC2) is detected by the refrigerant leakage detection unit, the controller (70) switches the heat-source-side fourth control valve (22) to the opened state and causes the refrigerant release mechanism (21) to shift to the first state. The refrigerant release mechanism (21) is a rupture disk that shifts to the first state when a pressure in the refrigerant release circuit (RC3) becomes equal to or greater than a first threshold value (ΔTh1).
Inventors:
Takuro Yamada
Masahiro Honda
Masahiro Honda
Application Number:
JP2019534605A
Publication Date:
March 09, 2022
Filing Date:
August 03, 2018
Export Citation:
Assignee:
Daikin Industries, Ltd.
International Classes:
F25B49/02; F25B45/00
Domestic Patent References:
| JP2010002137A | ||||
| JP2004353578A | ||||
| JP1300170A | ||||
| JP2005233577A | ||||
| JP61074078U |
Foreign References:
| WO2015140876A1 | ||||
| US20050028540 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation
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