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Title:
REINFORCED COMPOUND PIPE AND ITS JOINING METHOD
Document Type and Number:
Japanese Patent JP2001021090
Kind Code:
A
Abstract:

To reduce a trouble for separating a fiber reinforcing layer and to provide firm joining strength by arranging a mold release layer for reducing adhesive strength between thermoplastic synthetic resin pipe and fiber reinforced resin layer.

A reinforced compound pipe 1 is coated with a FRP layer 3 through a mold release layer 4 on an outer periphery of a thermoplastic synthetic resin pipe 2. In the reinforced compound pipe 1, the FRP layer 3 is separated for a prescribed length for manufacturing a spigot for TS joining. The mold release layer 4 is arranged between the thermoplastic synthetic resin pipe 2 and the FRP layer 3, and is formed for easily separating and eliminating the FRP layer 3 when exposing the thermoplastic synthetic resin pipe 2 having a prescribed length for TS-joint of the FRP layer 3. It is thus possible to easily separate and eliminate the FRP layer 3 having the prescribed length necessary for TS-joining by means of pulling one end of a slit for expanding the FRP layer 3 with a slit formed annularly, or by mean of a simple jig such as a knife.


Inventors:
KAMIOKA HIROTSUGU
TAKAO HIDEAKI
Application Number:
JP19054399A
Publication Date:
January 26, 2001
Filing Date:
July 05, 1999
Export Citation:
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Assignee:
KYUSHU SEKISUI KOGYO CO LTD
International Classes:
F16L47/02; F16L1/024; (IPC1-7): F16L47/02; F16L1/024
Domestic Patent References:
JPH0825505A1996-01-30
JPH03124093U1991-12-17
JPH0310829A1991-01-18
Attorney, Agent or Firm:
99 high autumn