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Title:
REINFORCING THERMOSETTING STRUCTURAL MATERIAL
Document Type and Number:
Japanese Patent JPH03197559
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermosetting bismaleimide resin material which is suitable for the preparation of a fiber-reinforced prepreg using a film impregnation method by incorporating a thermosetting bismaleimide monomer, a specified comonomer, and a specified particulate soluble thermoplastic polyimide.

CONSTITUTION: In the preparation of a thermosetting bismaleimide resin material by incorporating a thermosetting bismaleimide monomer (A), a comonomer (B) selected from an alkenylphenol or an alkenylphenoxy-contg. comonomer and a diamine comonomer, and a soluble, particulate thermoplastic polyimide (C) having a particle size of 2 to about 30 μm in an amt. of 10 to about 60 wt.% based on the total amt. of the components (A), (B), and (C), a major part of a dianhydride residue is accounted for by the formula (X represents a covalent bond, -CR2-, -CO-, -O-CO-, -S-, -SO2- or the like; R represents phenyl or a 6 to 10C cycloalkyl) and 80 wt.% diamine residue corresponds to a residue of toluenediamine and methylenedianiline.


Inventors:
JIYATSUKU DAGURASU BOIDO
Application Number:
JP3504090A
Publication Date:
August 28, 1991
Filing Date:
February 15, 1990
Export Citation:
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Assignee:
BASF CORP
International Classes:
C08G73/12; C08J5/24; C08K5/17; C08K5/3415; C08K5/38; C08K7/02; C08L35/00; C08L79/08; (IPC1-7): C08G73/12; C08J5/24; C08K5/17; C08K5/3415; C08K5/38; C08L79/08
Attorney, Agent or Firm:
Kazuo Sato (2 outside)