Title:
中継基板、その製造方法、プローブカード
Document Type and Number:
Japanese Patent JP4862017
Kind Code:
B2
Abstract:
A method of manufacturing a semiconductor device includes preparing two package substrates, electrically coupling a semiconductor wafer to a measuring apparatus, inspecting the wafer, dicing the semiconductor wafer into semiconductor elements and packaging the semiconductor element over the prepared package substrates.
Inventors:
Osamu Mizoguchi
Application Number:
JP2008180601A
Publication Date:
January 25, 2012
Filing Date:
July 10, 2008
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
G01R1/073; G01R31/26; H01L21/66; H01R12/51
Domestic Patent References:
| JP7301642A | ||||
| JP2004111945A | ||||
| JP2007171140A | ||||
| JP2005189462A | ||||
| JP2002204076A | ||||
| JP200422664A | ||||
| JP1012809A |
Attorney, Agent or Firm:
Shinji Hayami
Kana Nomoto
Satoshi Amagi
Kana Nomoto
Satoshi Amagi