Title:
はく離フィルム、セラミック部品シート、及び積層セラミックコンデンサの製造方法
Document Type and Number:
Japanese Patent JP7435557
Kind Code:
B2
Abstract:
The present invention provides a release film comprising a base material and a release layer provided over the base material, wherein the release layer is a cured product of a composition containing a silicone resin having a reactive functional group and other polymerizing ingredients, and, as measured by XPS, when X is the silicon peak intensity for the surface of the release layer on the side facing away from the base material side, Y is the silicon peak intensity at a depth of 4.1 nm from said surface of the release layer, and Z is the silicon peak intensity measured when a silicone resin layer containing 90% or more polydimethylsiloxane has been formed, X is greater than Y, the ratio of X to Z is 40% or greater, and the ratio of Y to Z is 5 to 50%.
Inventors:
Tomoki Ushida
Masutatsu Mashita
山▲崎▼ 勝彦
Akinori Nishizawa
Shuji Iida
Masutatsu Mashita
山▲崎▼ 勝彦
Akinori Nishizawa
Shuji Iida
Application Number:
JP2021118649A
Publication Date:
February 21, 2024
Filing Date:
July 19, 2021
Export Citation:
Assignee:
SAE Magnetics(H.K.)Ltd.
International Classes:
B32B27/28; B28B1/30; B32B27/00; B32B27/30
Domestic Patent References:
| JP2010105384A | ||||
| JP2008133435A |
Foreign References:
| WO2013129080A1 | ||||
| WO2018159247A1 | ||||
| WO2016060084A1 | ||||
| WO2018150255A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami
Yoshiki Kuroki
Takashi Mikami