Title:
COMPOSITION FOR PEELING LAYER FORMATION AND PEELING LAYER
Document Type and Number:
Japanese Patent JP2022133827
Kind Code:
A
Abstract:
To provide a composition for peeling layer formation which enables formation of a device composed of a resin substrate on a peeling layer, and gives the peeling layer easily peeled at an interface between the peeling layer and the device composed of the resin substrate.SOLUTION: A composition for peeling layer formation contains (A) a polymer containing 1-70 mol% of a monomer having a Michael donor group with respect to 100 mol% of the total monomer units, (B) a crosslinking agent having a Michael acceptor group, and (C) a Michael addition reaction catalyst.SELECTED DRAWING: None
Inventors:
ITO JUN
Application Number:
JP2021032735A
Publication Date:
September 14, 2022
Filing Date:
March 02, 2021
Export Citation:
Assignee:
NISSAN CHEMICAL CORP
International Classes:
C08L101/02; B32B27/00; B32B27/26; B32B27/30; C08F212/00; C08F220/00; C08F222/00; C08L25/00; C08L33/00; C08L35/00; C09D125/00; C09D125/04; C09D133/08; C09D133/10; C09D133/20; C09D133/26; C09D135/00; C09D201/02
Attorney, Agent or Firm:
Hideaki International Patent Office