Title:
RELEASE LAYER-FORMING COMPOSITION AND RELEASE LAYER
Document Type and Number:
Japanese Patent JP2022136498
Kind Code:
A
Abstract:
To provide a release layer-forming composition that allows a device including a resin substrate or the like to be formed on a release layer, wherein the release layer formed from the composition can be easily released at an interface with the device including a resin substrate or the like.SOLUTION: A release layer-forming composition contains (A) a polymer prepared from a monomer (a) having a hydroxy group, a carboxy group, an amide group, an alkoxysilyl group and at least one group selected from the groups represented by formula (a1), and a monomer (b) different from the monomer (a), with the content of the monomer (a) being 1-30 mol% relative to the total monomer content of 100 mol%, and (B) a crosslinker having a methylol group or an alkoxymethyl group (where R is an alkyl group, an alkoxy group or a phenyl group, and a dashed line is a bond).SELECTED DRAWING: None
Inventors:
ITO JUN
Application Number:
JP2021036136A
Publication Date:
September 21, 2022
Filing Date:
March 08, 2021
Export Citation:
Assignee:
NISSAN CHEMICAL CORP
International Classes:
C09D201/02; B32B7/06; B32B27/00; C08K5/3447; C08K5/3492; C08K5/42; C08L33/24; C08L101/02; C09D5/20; C09D7/63; C09D125/08; C09D133/08; C09D133/10; C09D133/20; C09D133/26; C09D135/00; C09D183/00; C09D201/06; C09D201/08; C09D201/10
Attorney, Agent or Firm:
Hideaki International Patent Office