Title:
RELEASE SUBSTRATE, ITS MANUFACTURING METHOD AND RELEASABLE LAMINATE
Document Type and Number:
Japanese Patent JP2004202979
Kind Code:
A
Abstract:
To provide a release substrate capable of being manufactured in a short time (hihg speed molding) even by low-temperature laminate molding while keeping a level capable of sufficiently satisfying the adhesiveness between respective layers without using an adhesive such as an anchor coating agent or the like, a releasable laminate using the same and its manufacturing method.
In the release substrate 10 obtained by forming a release material layer 16 on a substrate 12 through an adhesive layer 14 without using the anchor coating agent, the resin layer 14 consists of a resin material containing 100-10 mass % of an ethylene (co)polymer (A) which satisfies specific conditions and 0-90 mass % of an other polyolefinic resin (B).
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Inventors:
MIYAJI OSAMU
KASAHARA HIROSHI
KASAHARA HIROSHI
Application Number:
JP2002377596A
Publication Date:
July 22, 2004
Filing Date:
December 26, 2002
Export Citation:
Assignee:
JAPAN POLYOLEFINS CO LTD
International Classes:
B32B27/32; B32B27/00; (IPC1-7): B32B27/32; B32B27/00
Domestic Patent References:
| JPH1080972A | 1998-03-31 | |||
| JP2001342306A | 2001-12-14 | |||
| JPH1087910A | 1998-04-07 |
Foreign References:
| WO1999065957A1 | 1999-12-23 | |||
| WO1999045063A1 | 1999-09-10 |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
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