Title:
REMOVAL METHOD OF RESIST-FILM IMAGE
Document Type and Number:
Japanese Patent JPH06196398
Kind Code:
A
Abstract:
PURPOSE: To provide a method wherein an image into which ions have been implanted on a semiconductor substrate and which is composed of an inessential resist film is removed in the manufacture of a semiconductor integrated circuit device.
CONSTITUTION: In the removal method of an image which exists on a semiconductor substrate and which is composed of a resist material, a substance having a function of easily removing the image is brought into contact with the resist- film image as a pretreatment, an adhesive sheet or the like is then pasted on the resist-film image, and the adhesive sheet or the like and the resist material are stripped integrally.
Inventors:
NAMIKAWA AKIRA
KIHARA YASUO
SAITO KIYOSHI
AIZAWA KAORU
SHIMODAN HIDEAKI
NAKAZAWA JUN
KIHARA YASUO
SAITO KIYOSHI
AIZAWA KAORU
SHIMODAN HIDEAKI
NAKAZAWA JUN
Application Number:
JP30386092A
Publication Date:
July 15, 1994
Filing Date:
November 13, 1992
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J5/00; C09J7/02; G03F7/42; H01L21/027; H01L21/30; (IPC1-7): H01L21/027; C09J5/00; C09J7/02; G03F7/42
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