Title:
半導体処理におけるエッチング後の残留物の除去
Document Type and Number:
Japanese Patent JP2006526895
Kind Code:
A
Abstract:
A novel cleaning composition used for post-etch resist residue removal is disclosed. In contrast to the conventional cleaning solutions based on fluoride chemistries, the present invention can significantly reduce the oxide loss resulting from the exfoliation, while still providing an excellent cleaning efficiency.
Inventors:
Selnut, mihaela
Lee, Shewing
Lee, Shewing
Application Number:
JP2006514212A
Publication Date:
November 24, 2006
Filing Date:
May 03, 2004
Export Citation:
Assignee:
EK Technology, Incorporated
International Classes:
H01L21/304; C11D1/00; C11D7/08; C11D7/32; C11D7/50; C11D11/00; C23F11/14; C23F11/167; C23F11/173; C23G1/06; H01L21/02; H01L21/027; H01L21/311; H01L21/306
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Kaoru Kuroda
Yasuhito Suzuki
Eiji Katayama
Kaoru Kuroda
Yasuhito Suzuki