PURPOSE: To remove wiring soldered to a pad formed on the substrate of a printed board of such a kind that the adhesion between the substrate and pad is relatively weak as the auxiliary wiring, etc., of the printed wiring of the printed board without stripping off the pad at the time of changing a circuit, etc.

CONSTITUTION: By using a heating chip which covers a soldered wiring material and is provided with a recessed section having a cavity at least larger than the outside diameter of the wiring material enclosed in solder from the upper margin of the solder and a heat generating section which supplies heat reaching the melting point of the solder to the recessed section, the heating chip is press- contacted 10 with a pad by means of the recessed section so that the recessed section can cover the soldered part of wiring and the solder is melted 11 by raising the temperature of the heating chip to a prescribed temperature for a prescribed period of time. Then the wiring is removed 12 from the solder part after removing the heating chip.