Title:
RESIGN DIAMOND BLADE AND METHOD OF MANUFACTURING OPTICAL WAVEGUIDE USING THE BLADE
Document Type and Number:
Japanese Patent JP3857118
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical waveguide in which the end face is ground at the same time of a dicing.
SOLUTION: The method of manufacturing a silicon-based optical waveguide includes a step in which a silicon wafer having a plurality of optical waveguides formed inside is prepared, a step in which a cut groove is formed on the silicon wafer by performing a first dicing by using a first resign diamond blade having a thickness t1, and a step in which the end face of the optical waveguide is ground by performing a second dicing on the silicon wafer along the cut groove by using a second resign diamond blade having a thickness t2 which is larger than t1. It is necessary that the second resign diamond blade includes diamond abrasive grain of which size is 2 μm or smaller and the relation t1+0.01 mm≤t2≤t1+0.05 mm is satisfied.
Inventors:
Akio Maeda
Ryuji Shiotani
Ryuji Shiotani
Application Number:
JP2001370603A
Publication Date:
December 13, 2006
Filing Date:
December 04, 2001
Export Citation:
Assignee:
富士通株式会社
International Classes:
G02B6/13; B24B19/22; B24B27/06; B24D3/00; B24D3/28; B24D5/12; B28D5/02; B81C1/00; G02B6/12; H01L21/00; H01L21/301; (IPC1-7): G02B6/13; B24B27/06; B24D3/00; B24D3/28; B24D5/12; B81C1/00; G02B6/12; H01L21/301
Domestic Patent References:
| JP10133041A | ||||
| JP10300961A | ||||
| JP5261668A | ||||
| JP2001088016A | ||||
| JP2001091778A |
Attorney, Agent or Firm:
Akira Matsumoto
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