Title:
RESIN APPLICATOR
Document Type and Number:
Japanese Patent JPH06120276
Kind Code:
A
Abstract:
PURPOSE: To accurately control the thickness of an applied film of resin.
CONSTITUTION: In a resin applicator for semiconductor device in which a copper wiring 2 is formed on a tape 1 composed of polyimide film and semiconductor chips 3 are connected with the tape so that assembly is performed according to TAB system, the thickness of resin after the application of a sealing resin 10 to the semiconductor chip 3 and a lead around the chip is measured in non- contact manner by a focusing device 9 before the start of a drying process, and air pressure to be fed to a syringe 5 and the discharge from a nozzle 6 are controlled by a dispenser controller 8 on the basis of the results of this measurement.
Inventors:
KAWANOBE TORU
Application Number:
JP26713492A
Publication Date:
April 28, 1994
Filing Date:
October 06, 1992
Export Citation:
Assignee:
HITACHI LTD
HITACHI TOKYO ELECTRONICS
HITACHI TOKYO ELECTRONICS
International Classes:
H01L21/56; (IPC1-7): H01L21/56
Attorney, Agent or Firm:
Yamato Tsutsui
Previous Patent: Cutter implement
Next Patent: MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Next Patent: MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE