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Patent Searching and Data


Title:
RESIN BOND WHEEL
Document Type and Number:
Japanese Patent JP2005246519
Kind Code:
A
Abstract:

To provide a resin bond wheel improved in surface roughness while maintaining sharpness, hardly causing thermal damage to a cut material and abrasive grains and easily detecting contact with the cut material.

An abrasive grain layer 2 formed on a base metal 1 is formed in network structure wherein boundary parts between abrasive grains 3 and resin grains 4 and mutual boundary parts of the resin grains 4 are covered with layers 5 comprising carbon nanotubes formed of material with high electric conductivity and high heat conductivity. The formation of the abrasive grain layer 2 of network structure can be achieved by mixing such carbon nanotubes that the average grain diameters of the abrasive grains 3 and resin grains 4 are at least ten times as large as the diameter of the carbon nanotubes, in the abrasive grains 3 and resin grains 4. The layers 5 comprising the carbon nanotubes are formed to be connected to the base metal 1. This connection can be achieved by forming the mixed layer of the carbon nanotubes and resin beforehand on the base metal 1, and then forming the abrasive grain layer 2.


Inventors:
TAKEUCHI TSUTOMU
Application Number:
JP2004058083A
Publication Date:
September 15, 2005
Filing Date:
March 02, 2004
Export Citation:
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Assignee:
NORITAKE SUPER ABRASIVE KK
NORITAKE CO LTD
International Classes:
B24D3/02; B24D3/28; (IPC1-7): B24D3/02; B24D3/28
Attorney, Agent or Firm:
Hisashi Kato