To provide a resin box body embedded with circuit resin where a printed-wiring board and a box body resin have high adhesive properties, in the resin box body embedded with an electronic circuit in which the printed-wiring board is integrated with the box body resin.

In the resin box body embedded with the electronic circuit, a thermoplastic resin layer is fused and formed on the printed-wiring board with the electronic circuit formed on one surface or both surfaces of a molding of a graft copolymer (A). The graft copolymer (A) is obtained by graft-polymerizing a 15 to 40 pts.mass aromatic polyvinyl monopolymer to a 60 to 85 pts.mass random or block copolymer composed of a component based on an α-olefin monomer or a conjugated diene monomer. A polyfunctional aromatic polyvinyl monomer in the whole aromatic polyvinyl monomer is set in 5 to 35 mass%. The thermoplastic resin layer is fused on the printed-wiring board by an insert molding method.

COPYRIGHT: (C)2011,JPO&INPIT